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NSS12500UW3T2G 12 V, 8.0 A, Low VCE(sat) PNP Transistor
ON Semiconductor's e2 PowerEdge family of low VCE(sat) transistors are miniature surface mount devices featuring ultra low saturation voltage (VCE(sat)) and high current gain capability. These are designed for use in low voltage, high speed switching applications where affordable efficient energy control is important. Typical applications are DC-DC converters and power management in portable and battery powered products such as cellular and cordless phones, PDAs, computers, printers, digital cameras and MP3 players. Other applications are low voltage motor controls in mass storage products such as disc drives and tape drives. In the automotive industry they can be used in air bag deployment and in the instrument cluster. The high current gain allows e2PowerEdge devices to be driven directly from PMU's control outputs, and the Linear Gain (Beta) makes them ideal components in analog amplifiers. * This is a Pb-Free Device
MAXIMUM RATINGS (TA = 25C)
Rating Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current - Continuous Collector Current - Peak Electrostatic Discharge Symbol VCEO VCBO VEBO IC ICM ESD Max -12 -12 -7.0 -5.0 -8.0 Unit Vdc Vdc Vdc Adc A
2 1 3
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12 VOLTS 8.0 AMPS PNP LOW VCE(sat) TRANSISTOR EQUIVALENT RDS(on) 55 mW
COLLECTOR 3 1 BASE 2 EMITTER WDFN3 CASE 506AU
MARKING DIAGRAM
VE M G 1 VE = Specific Device Code M = Date Code G = Pb-Free Package
HBM Class 3B MM Class C
THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation, TA = 25C Derate above 25C Thermal Resistance, Junction-to-Ambient Total Device Dissipation, TA = 25C Derate above 25C Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Lead #3 Total Device Dissipation (Single Pulse < 10 sec) Junction and Storage Temperature Range Symbol PD (Note 1) RqJA (Note 1) PD (Note 2) RqJA (Note 2) RqJL (Note 2) PDsingle (Notes 2 & 3) TJ, Tstg Max 875 7.0 143 1.5 11.8 85 23 3.0 -55 to +150 Unit mW mW/C C/W W mW/C C/W C/W W C
ORDERING INFORMATION
Device NSS12500UW3T2G Package WDFN3 (Pb-Free) Shipping 3000/ Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-4 @ 100 mm2, 1 oz copper traces. 2. FR-4 @ 500 mm2, 1 oz copper traces. 3. Thermal response.
(c) Semiconductor Components Industries, LLC, 2006
1
July, 2006 - Rev. 0
Publication Order Number: NSS12500UW3/D
NSS12500UW3T2G
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic OFF CHARACTERISTICS Collector -Emitter Breakdown Voltage (IC = -10 mAdc, IB = 0) Collector -Base Breakdown Voltage (IC = -0.1 mAdc, IE = 0) Emitter -Base Breakdown Voltage (IE = -0.1 mAdc, IC = 0) Collector Cutoff Current (VCB = 12 Vdc, IE = 0) Emitter Cutoff Current (VEB = -7.0 Vdc) ON CHARACTERISTICS DC Current Gain (Note 4) (IC = -10 mA, VCE = -2.0 V) (IC = -500 mA, VCE = -2.0 V) (IC = -1.0 A, VCE = -2.0 V) (IC = -2.0 A, VCE = -2.0 V) (IC = -3.0 A, VCE = -2.0 V) Collector -Emitter Saturation Voltage (Note 4) (IC = -0.1 A, IB = -0.010 A) (Note 5) (IC = -1.0 A, IB = -0.100 A) (IC = -1.0 A, IB = -0.010 A) (IC = -2.0 A, IB = -0.020 A) (IC = -3.0 A, IB = -0.030 A) (IC = -4.0 A, IB = -0.400 A) Base -Emitter Saturation Voltage (Note 4) (IC = -1.0 A, IB = -0.01 A) Base -Emitter Turn-on Voltage (Note 4) (IC = -2.0 A, VCE = -3.0 V) Cutoff Frequency (IC = -100 mA, VCE = -5.0 V, f = 100 MHz) Input Capacitance (VEB = -0.5 V, f = 1.0 MHz) Output Capacitance (VCB = -3.0 V, f = 1.0 MHz) SWITCHING CHARACTERISTICS Delay (VCC = -10 V, IC = 750 mA, IB1 = 15 mA) Rise (VCC = -10 V, IC = 750 mA, IB1 = 15 mA) Storage (VCC = -10 V, IC = 750 mA, IB1 = 15 mA) Fall (VCC = -10 V, IC = 750 mA, IB1 = 15 mA) 4. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle 2%. 5. Guaranteed by design but not tested. td tr ts tf - - - - - - - - 100 150 350 200 ns ns ns ns hFE 250 250 250 200 180 VCE(sat) - - - - - - VBE(sat) - VBE(on) - fT 100 Cibo Cobo - - - - 650 210 pF pF 0.800 -0.900 MHz 0.760 -0.900 V -0.008 -0.055 -0.080 -0.135 -0.190 -0.200 -0.012 -0.070 -0.100 -0.170 -0.240 -0.260 V - - 300 300 250 - - - - - V V(BR)CEO -12 V(BR)CBO -12 V(BR)EBO -7.0 ICBO - IEBO - - -0.1 - -0.1 mAdc - - mAdc - - Vdc - - Vdc Vdc Symbol Min Typical Max Unit
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NSS12500UW3T2G
0.5 VCE(sat), COLLECTOR EMITTER SATURATION VOLTAGE (V) VCE(sat), COLLECTOR EMITTER SATURATION VOLTAGE (V) IC/IB = 10 0.4 3.0 IC/IB = 100 2.5 2.0 1.5 VCE(sat) = -55C 1.0 150C 0.5 0 0.001 0.01 0.1 1.0 10 0.001 0.01 0.1 1.0 IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A) 25C 10
0.3 VCE(sat) = 150C 0.2 -55C 0.1 25C 0
Figure 1. Collector Emitter Saturation Voltage vs. Collector Current
Figure 2. Collector Emitter Saturation Voltage vs. Collector Current
700 150C (5 V) 150C (2 V) 500 400 300 200 100 0 0.001 0.01 0.1 1 10 IC, COLLECTOR CURRENT (A) 25C (5 V) 25C (2 V) -55C (5 V) -55C (2 V) VBE(sat), BASE EMITTER SATURATION VOLTAGE (V) 600 hFE, DC CURRENT GAIN
1.4 1.2 1.0 -55C 0.8 0.6 0.4 0.2 0 0.001 0.01 0.1 1.0 10 IC, COLLECTOR CURRENT (A) 25C 150C
Figure 3. DC Current Gain vs. Collector Current
Figure 4. Base Emitter Saturation Voltage vs. Collector Current
VBE(on), BASE EMITTER TURN-ON VOLTAGE (V)
1.2 VCE = -1.0 V 1.0 -55C 0.8 0.6 150C 0.4 0.2 0 0.001 0.01 0.1 1.0 10 IC, COLLECTOR CURRENT (A) 25C
VCE, COLLECTOR-EMITTER VOLTAGE (V)
1.0 10 mA 0.8 100 mA 300 mA IC = 500 mA
0.6
0.4
0.2 0 0.01 0.1 1.0 10 100 IB, BASE CURRENT (mA)
Figure 5. Base Emitter Turn-On Voltage vs. Collector Current http://onsemi.com
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Figure 6. Saturation Region
NSS12500UW3T2G
650 600 550 500 450 400 350 300 250 200 0 1.0 2.0 3.0 4.0 5.0 6.0 VEB, EMITTER BASE VOLTAGE (V) Cibo (pF) Cobo, OUTPUT CAPACITANCE (pF) Cibo, INPUT CAPACITANCE (pF) 350 300 250 200 150 100 50 0 0 2.0 4.0 6.0 8.0 10 12 14 VCB, COLLECTOR BASE VOLTAGE (V) Cobo (pF)
Figure 7. Input Capacitance
Figure 8. Output Capacitance
10 1.0 mS
1 IC (A)
10 mS 100 mS 1.0 S Thermal Limit
0.1
0.01 0.1 1 VCE (Vdc) 10 100
Figure 9. PNP Safe Operating Area
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NSS12500UW3T2G
PACKAGE DIMENSIONS
WDFN3 CASE 506AU-01 ISSUE O
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L MIN 0.70 0.00 0.25 1.40 0.90 MILLIMETERS NOM MAX 0.75 0.80 0.05 0.20 REF 0.30 0.35 2.00 BSC 1.50 1.60 2.00 BSC 1.00 1.10 1.30 BSC 0.35 REF 0.40 0.45 MIN 0.028 0.000 0.010 INCHES NOM 0.030 MAX 0.031 0.002 0.014 0.063 0.043
D
A B
PIN ONE REFERENCE
2X
0.10 C
2X
0.10 C
0.10 C
8X
0.08 C
SEATING PLANE
A1
2X
L K 0.400 1.600 E2 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 0.275
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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CCCC CCCC CCCC CCCC
D2 e
1
E
0.35
0.008 REF 0.012 0.079 BSC 0.055 0.059 0.079 BSC 0.035 0.039 0.051 BSC 0.014 REF 0.014 0.016
0.018
TOP VIEW
SOLDERING FOOTPRINT*
A
2X
1.300 0.400 0.600 C 0.250 1.100
SIDE VIEW
(A3)
e/2
2
0.300
3 3X
b
0.10 C A B 0.05 C
NOTE 3
BOTTOM VIEW
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NSS12500UW3/D

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